IEC 60664-3 PDF

IEC RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition. IEC applies to assemblies protected against pollution by the use of coating, potting or moulding, thus allowing a reduction of clearance and creepage distances as described in IEC This document describes the requirements and test procedures for two methods of protection: - type 1 protection improves the microenvironment of the parts under the protection; - type 2 protection is considered to be similar to solid insulation. This edition includes the following significant technical changes with respect to the previous edition: a information added concerning interpolation; b provided scratch test is only for type 2 protection; c renumbered the scratch test to follow the visual examination test, since it makes more sense there; d separated the tables under what is now called Annex A, to make them clearer. It has the status of a basic safety publication in accordance with.

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Document Center Inc. The following bibliographic material is provided to assist you with your purchasing decision: Applies to assemblies protected against pollution by the use of coating, potting or moulding, thus allowing a reduction of clearance and creepage distances as described in Part 1 or Part 5.

This standard describes the requirements and test procedures for two methods of protection: - type 1 protection improves the microenvironment of the parts under the protection; - type 2 protection is considered to be similar to solid insulation.

This standard also applies to all kinds of protected printed boards, including the surface of inner layers of multi-layer boards, substrates and similarly protected assemblies. In the case of multi-layer printed boards, the distances through an inner layer are covered by the requirements for solid insulation in Part 1.

This standard refers only to permanent protection. It does not cover assemblies that are subjected to mechanical adjustment or repair. The principles of this standard are applicable to functional, basic, supplementary and reinforced insulation. Has the status of a basic safety publication in accirdance with IEC Guide The major changes made during the revision of IEC were the following: - Part 3 has been exactly aligned with Part 1 including amendments 1 and 2.

It has been made clear that Part 3 can only be used as a whole document together with Part 1 of IEC The standard also applies to all kinds of coated printed boards including the surface of inner-layers of multi-layer boards, substrates and similar protected assemblies. The distances through an inner layer of multi-layer boards however are covered by the requirements for solid insulation in Part 1.

Type 1 formerly type A protection leads to a reduction of the pollution degree present beyond the protection to pollution degree 1. Type 2 formerly type B protection introduces protection systems which can be considered similar to solid insulation. Consequently the dimensioning and test requirements have been aligned more correctly. The protected assembly shall withstand the electrical tests for solid insulation in 4.

For type 1 protection, the partial discharge test is not applicable. For type 2 protection, the partial discharge test is required. The required partial discharge extinction voltage and the test method are specified in 4.

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IEC 60664-3

Document Center Inc. The following bibliographic material is provided to assist you with your purchasing decision: Applies to assemblies protected against pollution by the use of coating, potting or moulding, thus allowing a reduction of clearance and creepage distances as described in Part 1 or Part 5. This standard describes the requirements and test procedures for two methods of protection: - type 1 protection improves the microenvironment of the parts under the protection; - type 2 protection is considered to be similar to solid insulation. This standard also applies to all kinds of protected printed boards, including the surface of inner layers of multi-layer boards, substrates and similarly protected assemblies. In the case of multi-layer printed boards, the distances through an inner layer are covered by the requirements for solid insulation in Part 1.

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